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Printed circuit boards - one and two layers




Printed circuit boards - one and two layers

* Base material glasstextolit FR4 type FR2, FR3, CEM 1;
   With thickness from 0.8 to 2.4mm and copper foli 18µm, 35µm and 70µm;
* mimimal diameter of drilled holes - 0.6mm;
* minimum width of track and the distances between them - 0.2mm;
* maximum dimensions of printing plates - 450 x 600mm;
*thickness of the copper coating in the hole 18 - 20µm;
*minimum thickness of galvanic precipitationed potassium-lead resist - 7.5µm;
*coating with gold of sections of plates:
   *  nickel - to 7µm;
   *  gold - to 2µm;
* security solder mask - conventional, UV, photo mask;
* address designations;
* striping of potassium-lead coating;
* laying on of potassium-lead coating in hot method;
* selective laying on of electricity conductive pastes;
* selective security in soldering;
* cutting of contour-stamping or milling;
* electrical test of plates.

Printed circuit boards



Installed printing plates

* conventional installation;
* solder electrowaves;
* surface installation (SMD) and soldering.

Installed printing plates